Galaxy Microsystems Ltd.
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- All photos, specifications, contents are used for reference only and are subject to change without notice. Actual products in different countries varies and are best to consult your local distributor / importer for confirmation.
- Solventless formulation
- Flowable
- Non Curing - no need for curing ovens
- Capable of achieving thin Bond Line Thickness for optimum performance
- Very Low thermal resistance
- High thermal conductivity
- Conducts heat away from sensitive components
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